Muhammad Nagi Email

Muhammad Nagi Skills

• Analog Circuit Design
• Ansys shock analysis as well as MEMS structure analysis and modification to fit in a certain resonance freq. constraint
• Application-Specific Integrated Circuits (ASIC)
• Automation
• Backend process experience in clean room: wirebonding, die attach, probestation testing
• Bilingual Arabic and English, French: Beginner level
• Characterization
• Debugging
• Digital IC Design
• Electronics Packaging
• Embedded systems coding and implementation with C language
• FEA analysis for MEMS for ex.: shock analysis using Solidworks
• Failure Analysis
• Handling relationship with vendors
• Hardware Bring-up
• Inventor 3D enclosure design
• KGD
• Lab procurement
• Laboratory Skills
• Leading chip tapeouts
• Low-power Design
• MATLAB
• MEMS
• MEMS Mechanical Design
• MEMS Optical Design
• MEMS Reliability & Qualification testing
• Microsoft excel proficiency
• Microsoft project planning, preparing budgets for projects
• On wafer measurements
• Optical MEMS Charachterization
• Optical MEMS layout using L-edit with experience in coding macros
• Optical design, analysis and simulation using Matlab
• Optical lab testing experience with optical table, test equipment, fiber handling, micro optical components handling, mechanical single axis to 6 axis positioners setup design and implementation, optical microscope
• Optics
• PCB layout
• Probe Station
• Probecard design and testing
• Product Packaging
• Product enclosure manufacturing
• Purchasing
• Python (Programming Language)
• Reliability Testing
• Reliability qualification of MEMS chips
• SEM measurements in clean room
• Scanning Electron Microscopy (SEM)
• Shell Scripting
• Simulations
• Simvision
• System level Design
• Test Automation
• Timing Closure
• Transfer to Production
• VLSI
• Verdi
• Verilog
• Verilog RTL, micro‑architecture, Verdi, SimVision, Design Compiler, SpyGlass, UVM debug, waveform/root‑cause, HBM3/3e/4 init & training, pre‑silicon triage, sim→bring‑up, oscilloscope, signal generator, temperature chambers, shock/vibration, SEM, X‑ray CT, microscope, wire‑bonding/die‑attach, JEDEC, MIL‑STD, wafer‑level KGD, probe‑card, wafer‑map automation, production transfer (HVM), chiplet‑style integration, Python, Tcl, Shell, MATLAB.