Muhammad Kabir Email & Phone Number
Product Packaging Integration Engineer @ Intel Corporation
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Muhammad Kabir Location
- Hillsboro, OR, US
Muhammad Kabir Work
- Product Packaging Integration Engineer @ (July 2025 - Present)
- Process Integration Engineer @ (January 2022 - July 2025)
- Research Assistant @ (January 2017 - November 2021)
- Process Engineering Intern @ (August 2020 - March 2021)
- Research and Teaching Assistant @ (August 2014 - May 2016)
- Adjunct Professor @ (January 2012 - June 2014)
- Student Intern @ (December 2010 - December 2010)
- Student Intern @ (November 2010 - December 2010)
Muhammad Kabir Education
- Rochester Institute of Technology
Doctor of Philosophy - PhD (Microsystems Engineering)
2016-2021 - Clemson University
Master of Science - MS (Materials Science and Engineering)
2014-2016 - Military Institute of Science and Technology (MIST)
Bachelor of Science - BS (Electrical, Electronic and Communication Engineering)
2008-2011
Muhammad Kabir Skills
- Interpersonal Skills
- Electrical Engineering
- Semiconductor Fabrication
- Lithography
- Thin Film Characterization
- Mathematical Modeling
- Materials Science
- Programming
- Electronics
- VLSI
- Simulations
- Signal Processing
- Thin Films
- Scanning Electron Microscopy
- Physics
- Lean Six Sigma Green Belt
- Matlab
- LaTeX
- Pspice
- Altera Quartus
- University Teaching
- Public Speaking
- DSCH
- Microprocessors
- Semiconductor Device
- Maple
- Differential Scanning Calorimetry
- TGA
- IR Spectroscopy
- Microwind
- Electropolishing
- Optical Microscopy
- CISCO Packet Tracer
- Sputtering
- Thermal Evaporation
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Annealing
- Wet Chemical Etching
- Spin Coating
- Atomic Layer Deposition
- Ellipsometry
- Dry Etch
- Wet Chemistry
- Mentor Graphics
- Pyxis
- Athena
- Atlas
- Ion Implantation
- TCAD
- JMP
- Solar Cells
- PowerPoint
- Digital Electronics
- C
- Teaching
- Plasma Enhanced Chemical Vapor Deposition Pecvd
- Microsoft Office
- Microsoft Word
- C++
- Research
- Science
- Plasma Enhanced Chemical Vapor Deposition
Muhammad Kabir Summary
- Muhammad Kabir, based in Hillsboro, OR, US, is currently a Product Packaging Integration Engineer at Intel Corporation. Muhammad Kabir brings experience from previous roles at Intel Corporation, Rochester Institute of Technology and Clemson University. Muhammad Kabir holds a 2016 - 2021 Doctor of Philosophy - PhD in Microsystems Engineering @ Rochester Institute of Technology. With a robust skill set that includes Interpersonal Skills, Electrical Engineering, Semiconductor Fabrication, Lithography, Thin Film Characterization and more. Muhammad Kabir has 1 emails and 2 mobile phone numbers on RocketReach.
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