Package Development Engineer @ Custom Silicon Configuration Services NV (January 1998 - January 2000)
FEA Application Engineer @ (January 1995 - January 1998)
Moses Chan Education
University of Strathclyde
PhD. in Mechanics of Materials (BEng (1st class Honours) in Mechanical Engineering, Mechanical Engineering)
Moses Chan Skills
ASIC
Analog
AutoCAD
Design of Experiments
Electronics
Electronics Packaging
Engineering Management
Failure Analysis
IC
Mixed Signal
Packaging Engineering
Product Development
RF
SPC
Semiconductor Industry
Semiconductors
Signal Integrity
Six Sigma
Thermal Analysis
Verilog
Moses Chan Summary
Moses Chan, based in California, United States, is currently a SPE IC Package Development, Network Business Unit at MACOM. Moses Chan brings experience from previous roles at Microsemi Corporation - Ethernet & Network Technology Business Unit, Vitesse Semiconductor is now Microsemi, Xponent Photonics and Vitesse Semiconductor. Moses Chan holds a PhD. in Mechanics of Materials in BEng (1st class Honours) in Mechanical Engineering, Mechanical Engineering @ University of Strathclyde. With a robust skill set that includes ASIC, Analog, AutoCAD, Design of Experiments, Electronics and more. Moses Chan has 3 emails and 2 mobile phone numbers on RocketReach.
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