Mohd Hashim's Location
Shah Alam, MY
Mohd Hashim's Work
- Principal Engineer Process Integration @ NXP Semiconductors
- Staff Engineer (UPD) | Soft Solder Writing Die Attach and Clip Attach | Cu Clip Power Package @ Infineon Technologies
- Senior Process Engineer | Epoxy Die Bond (QFP and BGA) | RFiD Pioneers for FOL @ NXP acquires Freescale Semiconductor
- Process Engineer | Flip Chip Die Attach (BGA) @ STMicroelectronics
- Practical Engineer | Coal Handling Power Plant @ Malakoff Corporation Berhad
Mohd Hashim's Education
- Universiti Teknologi MARA
Bachelor's Degree (Electrical Engineering)
2007 - 2010 - Universiti Teknologi MARA
Diploma (Electrical Engineering)
2004 - 2007 - Sekolah Menengah Teknik Muar
SPM 2001-2002 (Electrical and Electronics Engineering)
Mohd Hashim's Skills
- Visual Basic
- Microsoft Office
- C++
- MPLAB
- Pspice
- Adobe Photoshop
- C Language
- Protel
- Matlab
- Internet
Mohd Hashim's Summary
Mohd Hashim, based in Shah Alam, MY, is currently a Principal Engineer Process Integration at NXP Semiconductors, bringing experience from previous roles at Infineon Technologies, NXP acquires Freescale Semiconductor, STMicroelectronics and Malakoff Berhad. Mohd Hashim holds a 2007 - 2010 Bachelor's Degree in Electrical Engineering @ Universiti Teknologi MARA. With a robust skill set that includes Visual Basic, Microsoft Office, C++, MPLAB, Pspice and more, Mohd Hashim contributes valuable insights to the industry. Mohd Hashim has 1 email on RocketReach.
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