Mohammed Alhendi Email & Phone Number
Research Hardware Developer: Chiplet and Advanced Packaging @ IBM
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Mohammed Alhendi Location
- Vestal, NY, US
Mohammed Alhendi Work
- Research Hardware Developer: Chiplet and Advanced Packaging @ (April 2024 - Present)
- Assistant Technical Director, Research Scientist @ Center for Advanced Microelectronics Manufacturing (June 2021 - April 2024)
- Graduate Research Associate @ Binghamton University, S3IP, (Center for Advanced Microelectronics Manufacturin (January 2017 - May 2021)
- Teaching Assistant @ (August 2016 - May 2017)
- Biomedical Lab Engineer @ University of Science and Technology (March 2013 - August 2013)
- Biomedical Engineer @ University of Science and Technology Hospital (December 2012 - March 2013)
- Graduate Trainee @ Natco Alrazi for Medical Devices (June 2012 - September 2012)
Mohammed Alhendi Education
- Binghamton University
Doctor of Philosophy (Ph.D.) (Industrial and Systems Engineering)
2016-2021 - Jordan University of Science and Technology
Master's degree (Mechatronics, Robotics, and Automation Engineering)
2013-2016 - Jordan University of Science and Technology
Bachelor of Science (B.Sc.) (Biomedical/Medical Engineering)
2007-2012
Mohammed Alhendi Skills
- Semiconductor Process
- BEOL
- FEOL
- Thin Film Deposition
- Electronics printing method (AJP, IJP, screen, and micro dispensing)
- Materials characterization (inks and substrates)
- Failure Analysis
- SMT
- Photolithography
- SEM, EDX, DSC, TGA, X-ray
- Project Management
- Process Development
- Materials Research
- Reliability Testing
- Statistical Process Control (SPC)
- Flexible Printed Electronics
- Team Leadership
- Electronics Manufacturing
- Additive Manufacturing
- Statistical Data Analysis
- Semiconductor Fabrication
- Electronics Packaging
- Reliability Engineering
- Flexible & Printed Electronics
- Process Engineering
- Data Analysis
- Statistics
- Minitab
- AutoCAD
- Aerosol Jet Printing
- Extrusion Based Printing
- Matlab
- Python
- Reliability
- Lean Six Sigma
- wearable electronics
- 3D printed electronics
Mohammed Alhendi Summary
- Mohammed Alhendi, based in Vestal, NY, US, is currently a Research Hardware Developer: Chiplet and Advanced Packaging at IBM. Mohammed Alhendi brings experience from previous roles at Center for Advanced Microelectronics Manufacturing, Binghamton University, S3IP, (Center for Advanced Microelectronics Manufacturin, Thomas J. Watson School of Engineering and Applied Science, Binghamton Universit and University of Science and Technology. Mohammed Alhendi holds a 2016 - 2021 Doctor of Philosophy (Ph.D.) in Industrial and Systems Engineering @ Binghamton University. With a robust skill set that includes Semiconductor Process, BEOL, FEOL, Thin Film Deposition, Electronics printing method (AJP, IJP, screen, and micro dispensing) and more. Mohammed Alhendi has 2 emails and 2 mobile phone numbers on RocketReach.
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