Modular Photonics Information

Modular Photonics: Connecting multicore fibre to unlock AI data centre capacity! AI is reshaping data centres. As GPU clusters scale, the optical interconnects linking them are running out of room: more fibres, more connectors, more ducts, more power. Multicore fibre (MCF) offers a step-change in capacity by carrying many independent channels in a single strand of glass. But realising that potential depends on one critical piece: getting light efficiently in and out of every core. That’s what we do. Modular Photonics designs and manufactures 3D glass photonic chips that provide low-loss, high-density connectivity to multicore fibre. Our fan-in/fan-out (FIFO) devices deliver best-in-class performance with insertion losses below 0.2 dB, bridging MCF to transceivers, switches and standard fibre infrastructure. We offer 4-core and 7-core FIFOs as standard products and have built custom devices for fibres with up to 22 cores, giving hyperscale operators and their supply chain a practical path to multiply fibre capacity without multiplying complexity. Our chips are made using ultrafast laser inscription (ULI), which writes waveguides directly in three dimensions inside glass. This gives us design freedom that planar photonics can’t match, along with fast iteration from concept to product and a scalable route to volume manufacturing. Headquartered in Sydney, Australia, we are working with partners across the optical ecosystem to bring multicore fibre into the AI data centre.