Ming Teh Email
Associate Software Engineer @ JPMorgan Chase & Co.
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Ming Teh Location
- Singapore
Ming Teh Work
- Associate Software Engineer @ (February 2022 - Present)
- 2024 Asia Pacific CEO Awards Winner @ (September 2024 - September 2024)
- Analyst Software Engineer @ (September 2019 - February 2022)
- Teaching Assistant @ (February 2018 - October 2021)
- Technology Analyst Intern (Summer) @ (May 2018 - August 2018)
- Teaching Assistant @ (August 2017 - December 2017)
- Software Engineer Intern @ (May 2017 - August 2017)
Ming Teh Education
- Singapore Management University
Bachelor of Science (B.Sc.) (Management Information Systems, General)
2015-2019
Ming Teh Skills
- Academic Support Services
- Amazon Web Services (AWS)
- Cascading Style Sheets (CSS)
- Customer Service
- Data Visualization
- HTML5
- Java
- JavaScript
- Kubernetes
- Leadership
- Microsoft Excel
- Microsoft Office
- Microsoft Word
- PowerPoint
- Public Speaking
- Python (Programming Language)
- Research
- SQL
- Software Development
- Tableau
Ming Teh Summary
- Ming Teh, based in Singapore, is currently a Associate Software Engineer at JPMorgan Chase & Co.. Ming Teh brings experience from previous roles at JPMorgan Chase & Co. and Hackwagon Academy. Ming Teh holds a 2015 - 2019 Bachelor of Science (B.Sc.) in Management Information Systems, General @ Singapore Management University. With a robust skill set that includes Academic Support Services, Amazon Web Services (AWS), Cascading Style Sheets (CSS), Customer Service, Data Visualization and more. Ming Teh has 2 emails on RocketReach.
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