Ming Cheng Location
Stanford, CA, US
Ming Cheng Work
Ming Cheng Education
Ming Cheng Skills
Ming Cheng Summary
Ming Cheng, based in Stanford, CA, US, is currently a Staff Engineer (Power Module Packaging) at Analog Devices. Ming Cheng brings experience from previous roles at Maxim Integrated, Stanford University and Maxim Integrated Products. Ming Cheng holds a 2010 - 2012 Master’s Degree in Structural/Mechanics @ Stanford University. With a robust skill set that includes AutoCAD, ANSYS, Social Media, Engineering, Matlab and more. Ming Cheng has 2 emails and 2 mobile phone numbers on RocketReach.