Ming Cheng Email & Phone Number
Staff Engineer (Power Module Packaging) @ Analog Devices
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Ming Cheng Location
- Stanford, CA, US
Ming Cheng Work
- Staff Engineer (Power Module Packaging) @ (December 2017 - Present)
- Member of Technical Staff, Packaging(Assembly and Manufacturing group) @ (August 2012 - November 2017)
- Graduate Teaching Assistant @ (March 2011 - June 2012)
- Master Student @ (September 2010 - June 2012)
- Summer Intern @ (June 2011 - September 2011)
- Research Assistant @ (March 2008 - June 2010)
Ming Cheng Education
- Stanford University
Master’s Degree (Structural/Mechanics)
2010-2012 - Tongji University
Bachelor’s Degree (Civil Engineering)
2008 - Fudan University
Minor (Finance, General)
2005-2007
Ming Cheng Skills
- AutoCAD
- ANSYS
- Social Media
- Engineering
- Matlab
- Manufacturing
- Design of Experiments
- Packaging
- Cross Functional Team Leadership
- Product Development
- Finite Element Analysis
- Characterization
- Thermal Modeling
- Semiconductors
- Management
- Failure Analysis
- Flotherm
- Design Of Experiments Doe
Ming Cheng Summary
- Ming Cheng, based in Stanford, CA, US, is currently a Staff Engineer (Power Module Packaging) at Analog Devices. Ming Cheng brings experience from previous roles at Maxim Integrated, Stanford University and Maxim Integrated Products. Ming Cheng holds a 2010 - 2012 Master’s Degree in Structural/Mechanics @ Stanford University. With a robust skill set that includes AutoCAD, ANSYS, Social Media, Engineering, Matlab and more. Ming Cheng has 2 emails and 2 mobile phone numbers on RocketReach.
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