Mike Spengler, based in New York, United States, is currently a Package Engineer at MOD-PAC Corp. Mike Spengler brings experience from previous roles at MOD-PAC Corp. Mike Spengler holds a Associate's degree in Mechanical Engineering/Mechanical Technology/Technician @ Erie Community College. With a robust skill set that includes Computer-Aided Design (CAD), Packaging Design, Tooling Design, Multitasking, Engineering and more. Mike Spengler has 2 emails on RocketReach.
Looking for a different Mike Spengler?
Find contact details for 700 million professionals.