Pacteon Group - Senior Vice President - Founding Partner and GM of Schneider Packaging Equipment @ Pacteon Group
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Mike Smith Location
Syracuse, NY, US
Mike Smith Work
2026 -
now Member Board of Directors @
2022 -
now PMMI Committee Member @
2020 -
now Pacteon Group - Senior Vice President - Founding Partner and GM of Schneider Packaging Equipment @
2023 -
now Fanuc Robotics Presidents Council @
2017 -
now Senior Vice President and Owner @
2017 -
2020 VP Engineering and Services and Owner @
2018 -
2020 RIA Board of Advisors @
2015 -
2018 Board Member @
2015 -
2017 CTO - VP Global Engineering at Arrow Intelligent Systems @
2014 -
2015 VP Engineering and Technology @
2004 -
2015 VP Engineering and Technology @
2008 -
2011 VP OEM and Engineering @
2007 -
2008 VP of Operations @
2006 -
2007 Director of Atlanta Division @
2009 -
2012 Advisory Board Member @
2007 -
2010 Board Of Advisors @
2006 -
2009 AMD Board of Advisors @
2000 -
2004 Senior Systems Engineer @
1991 -
2000 VP Technical Services @
Mike Smith Education
Henninger
High School
Syracuse University
Onondaga Community College
Mike Smith Skills
Product Management
Cloud Computing
Storage
Channel
Engineering
Business Development
Customer Service
Program Management
Product Development
Manufacturing
Account Management
Team Building
Lean Manufacturing
Process Improvement
Start-ups
New Business Development
Cross-functional Team Leadership
Business Strategy
Leadership
Strategic Planning
Integration
Product Lifecycle Management
Solution Selling
Channel Partners
Strategy
Product Marketing
Management
Go-to-market Strategy
Strategic Partnerships
Software
Product Lifecycle
Developers
Cross Functional Team
Start Ups
Cross Functional Team Leadership
Microsoft Office
Go to Market Strategy
Vertical Market
Computer Hardware
Mike Smith Summary
Mike Smith, based in Syracuse, NY, US, is currently a Pacteon Group - Senior Vice President - Founding Partner and GM of Schneider Packaging Equipment at Pacteon Group. Mike Smith brings experience from previous roles at PMMI: The Association for Packaging and Processing Technologies, FANUC America Corporation and Schneider Packaging Equipment Co., Inc.. Mike Smith holds a High School @ Henninger. With a robust skill set that includes Product Management, Cloud Computing, Storage, Channel, Engineering and more. Mike Smith has 2 emails and 5 mobile phone numbers on RocketReach.
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