Mikael Johansson's Location
Oulu, FI
Mikael Johansson's Work
- Technical Lead, SoC Packaging @ Nokia
- Principal Engineer, Assembly Technology @ Detection Technology
- Process Development Engineer @ Detection Technology
Mikael Johansson's Education
- University of Oulu
M.Sc. (Mechanical engineering, materials engineering, electronics, physical metallurgy)
1996 - 2003 - VSB - Technical University of Ostrava
(Materials engineering, process metallurgy)
2001 - 2001 - Salpausselän lukio, Lahti
High School Diploma
Mikael Johansson's Skills
- Materials
- Failure Analysis
- Reliability Engineering
- Technology Development
- Manufacturing
- Semiconductors
- IC packaging
- Semiconductor Packaging
- IC
- SoC
Mikael Johansson's Summary
Mikael Johansson, based in Oulu, FI, is currently a Technical Lead, SoC Packaging at Nokia, bringing experience from previous roles at Detection Technology and Nokia. Mikael Johansson holds a 1996 - 2003 M.Sc. in Mechanical engineering, materials engineering, electronics, physical metallurgy @ University of Oulu. With a robust skill set that includes Materials, Failure Analysis, Reliability Engineering, Technology Development, Manufacturing and more, Mikael Johansson contributes valuable insights to the industry. Mikael Johansson has 2 emails on RocketReach.
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