Microform Precision, LLC Competitors

PMA is the full-service trade association representing the $137-billion metalforming industry of North America—the industry that creates precision metal products using metal stamping, metal fabricating, metal spinning, metal slide forming and roll forming technologies, and other value-added processes. Its over 900 member companies also include suppliers of equipment, materials and services to the industry. PMA leads innovative member companies toward superior competitiveness and profitability through advocacy, networking, statistics, the PMA Educational Foundation, tradeshows and MetalForming magazine. PMA is a FABTECH event partner.

For 79 years, Detroit-based Weldaloy Specialty Forgings has provided quality forged products for the aerospace (space, aviation, defense), power generation, and electronics industries. A single source for custom copper, titanium, Inconel®, nickel, super alloys, stainless steel, and other non-ferrous metal forgings, we have created long-term partnerships with customers around the world. We are a leading domestic manufacturer of seamless rolled rings and open die forgings. Our manufacturing is 100% U.S. based; we have earned AS9100D and ISO9001:2015 QMS certifications, S1000 Certification, S291 Forging Approval, and are ITAR registered. Our engineering and metallurgy team assists customers in finding the best solutions for their forging needs. Weldaloy is also the parent company of Weldaloy Metallurgical and Non-Destructive Testing Laboratory, an independent, NADCAP® and ISO 17025 accredited lab.

Denton Vacuum enables innovation. From basic research to manufacturing—Denton Vacuum provides thin film deposition technology that delivers consistent, repeatable results through wide-process capability, ease-of-use, superior reliability, and global service and support. Denton Vacuum’s thin film deposition technologies provide superior performance in such applications as precision optics, lift-off & step coverage, dual-sided laser facet coating, indium for wafer level packaging, diamond-like carbon, metallization and medical coatings.