Michael Völkl Email
Technology Integrator Package Assembly @ Infineon Technologies
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Michael Völkl Location
- Alteglofsheim, BY, DE
Michael Völkl Work
- 2025 -now Technology Integrator Package Assembly @
- 2025 -2025 Senior Manager Unit Process Engineering Chip Card and Sensors @
- 2024 -2025 Manager Unit Process Engineering Chip Card and Sensors @
- 2023 -2023 Senior Staff Engineer Wirebonden @
- 2020 -2023 Staff Process Engineer Wirebonden @
- 2015 -2020 Unit Process Engineer Wirebonden SENS Produkte @
- 2012 -2015 Unit Process Engineer Preassembly Chip Separation @
- 2003 -2011 Prozessassistent Preassembly @
- 2000 -2003 Auszubildender zum Mikrotechnologen @
Michael Völkl Summary
- Michael Völkl, based in Alteglofsheim, BY, DE, is currently a Technology Integrator Package Assembly at Infineon Technologies. Michael Völkl brings experience from previous roles at Infineon Technologies. Michael Völkl has 1 emails on RocketReach.
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