2020 -2022 Principal Engineer - Chip Development @
2018 -2020 Packaging Technologist @
2016 -2018 Staff IC Packaging Engineer @
2011 -2016 Project Manager, Package and Backend Technology @
2009 -2011 Principal Engineer, R and D Advanced Packaging Division @
Michael Tong Education
UCLA
Ph.D. (Materials Science and Engineering)
UCLA
B.S. (Materials Science and Engineering)
UCLA
M.S. (Materials Science and Engineering)
Michael Tong Skills
Materials Science
Manufacturing
R&D
Integration
Nanotechnology
Thin Films
Electronics
Management
Failure Analysis
Silicon
Product Development
Semiconductor Industry
Design of Experiments
IC
Packaging Engineering
Vendor Management
Project Management
Design
CVD
Michael Tong Summary
Michael Tong, based in San Francisco, CA, US, is currently a Silicon Packaging Technologist, Custom Silicon and Advanced Packaging Partnerships Manager at Meta. Michael Tong brings experience from previous roles at Berkeley Lights, Inc., Google, Fitbit and TSMC North America. Michael Tong holds a Ph.D. in Materials Science and Engineering @ UCLA. With a robust skill set that includes Materials Science, Manufacturing, R&D, Integration, Nanotechnology and more. Michael Tong has 4 emails and 1 mobile phone numbers on RocketReach.
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