Design of Complex Board Level Design Using Leading Edge Components
Experience With Vxworks Bootrom and Bsp
Assembly and C for Powerpc and X86 Windows/Dos
Vpx 3u/6u and Cpci 3u/6u Backplane Interconnects
High Speed Serial Interconnects Such as Pcie
FPGA
Embedded C and Assembler Code for Pic
Firmware
Small Foot Print
Power Supply Design for Low Voltage
Experience With Vxworks
Assembly and C for Powerpc and X86
Michael Tinsley Summary
Michael Tinsley, based in England, United Kingdom, is currently a Senior electronics design engineer at Wipac Technology Ltd. Michael Tinsley brings experience from previous roles at Wipac Technology Ltd, Abaco Systems, Inc., GE Intelligent Platforms and Radstone Technology. With a robust skill set that includes Design of complex board-level design using leading edge components, High speed serial interconnects such as PCIe, DDR2/3, USB, SATA, Gigabit Enet, Power supply design for Low voltage, high current, small foot print, VME, VPX (3U/6U) & CPCI (3U/6U) backplane interconnects, Experience with VxWorks (Bootrom & BSP) and more. Michael Tinsley has 1 emails on RocketReach.
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