Michael Smith Email & Phone Number
Senior Semiconductor Packaging Engineer @ AMD
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Michael Smith Location
- Austin, TX, US
Michael Smith Work
- 2026 -now Senior Semiconductor Packaging Engineer @
- 2025 -2026 Semiconductor Packaging Engineer II @
- 2024 -2024 Advanced Packaging Engineering Intern @
- 2022 -2024 Research Assistant @
- 2022 -2022 Semiconductor Packaging Strategic R and D Intern @
- 2022 -2022 Associate Engineer @
- 2021 -2021 Equipment Engineering Intern @
- 2020 -2021 President of Colorado Alpha @
- 2021 -2021 Test Stand Mount Design Lead @ CU Sounding Rocket Laboratory
- 2020 -2021 Liquids Team Member @ CU Sounding Rocket Laboratory
- 2019 -2021 International Student Assistant @
- 2019 -2019 Design Project 2 @
- 2020 -2020 Mechanical Engineering Intern @ EMP - ElectroMechanical Products
- 2019 -2019 AgBot Team: Mechanical Design @
Michael Smith Education
- Purdue University
Master of Science - MS (Mechanical Engineering)
2022-2024 - Colorado School of Mines
Bachelor's degree (Mechanical Engineering)
2018-2021 - Lakeridge High School
Lake Oswego School District Diploma (4.20 Weighted)
2014-2018
Michael Smith Summary
- Michael Smith, based in Austin, TX, US, is currently a Senior Semiconductor Packaging Engineer at AMD. Michael Smith brings experience from previous roles at AMD, Purdue University and Texas Instruments. Michael Smith holds a 2022 - 2024 Master of Science - MS in Mechanical Engineering @ Purdue University. Michael Smith has 2 emails and 1 mobile phone numbers on RocketReach.
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