Michael Hirschmann Email
Head of Product Development Automotive Systems @ Semikron Danfoss
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Michael Hirschmann Location
- Oberasbach, BY, DE
Michael Hirschmann Work
- 2023 -now Head of Product Development Automotive Systems @
- 2022 -2023 Head of Electrical Engineering @
- 2019 -2022 Head of Electrical Engineering High Voltage Electronics @
- 2018 -2022 Head of Electrical Engineering HV Electronics @
- 2017 -2018 Project Manager @
- 2016 -2017 Technical Acquisition Manager @
- 2014 -2016 System Architect @
- 2011 -2014 Senior System Architect and Technical Project Manager @ Ericsson Modems
- 2009 -2011 RF System Engineer @ ST-ERICSSON AT GMBH
- 2006 -2009 RF Hardware Engineer @ TELECA GERMANY GMBH
Michael Hirschmann Education
- Technische Hochschule Nürnberg Georg Simon Ohm
Diplom Ingenieur (Electrical, Electronics and Communications Engineering)
2001-2006 - DIETRICH-BONHOEFFER-GYMNASIUM
Higher education entrance qualification
1990-2000
Michael Hirschmann Skills
- RF
- LTE
- Systems Design
- RF Engineering
- Embedded Systems
- Requirements Engineering
- Testing
- Mobile Communications
- Technical Project Leadership
- Hardware Architecture
- Project Management
- Embedded Software
- Wireless
- Concept Design
- Technical Project
- Engineering
- Java
- Microsoft Excel
- DSP
- Management
- Integration
Michael Hirschmann Summary
- Michael Hirschmann, based in Oberasbach, BY, DE, is currently a Head of Product Development Automotive Systems at Semikron Danfoss. Michael Hirschmann brings experience from previous roles at Baumüller Nürnberg GmbH, Vitesco Technologies and Continental. Michael Hirschmann holds a 2001 - 2006 Diplom Ingenieur in Electrical, Electronics and Communications Engineering @ Technische Hochschule Nürnberg Georg Simon Ohm. With a robust skill set that includes RF, LTE, Systems Design, RF Engineering, Embedded Systems and more. Michael Hirschmann has 2 emails on RocketReach.
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