Michael Dittrich Location
Dresden, SN, DE
Michael Dittrich Work
- 2020 - now Senior Staff IC Packaging Engineer @ Racyics
- 2012 - 2020 Researcher @ Fraunhofer IIS
- 2010 - 2011 Design Engineer Systems @ SeeReal Technologies
- 2009 - 2009 Working Student @ Fraunhofer IIS
- 2008 - 2008 Working Student @ ZMDI is now IDT
- 2007 - 2008 Working Student @ Technical University Dresden, Faculty of Computer Science, Institute for Compute
- 2004 - 2004 Trainee @ Vattenfall Europe Information Services
Michael Dittrich Education
- Technical University Dresden
Diploma (Information Engineering)
2004 - 2010
Michael Dittrich Skills
- Hardware Development
- Altera Quartus
- Signal Integrity
- CST Microwave Studio
- SPICE
- Pcb Technologies
- Visual Studio
- Mentor Expedition
- FPGA prototyping
- Parasitic Extraction
Michael Dittrich Summary
Michael Dittrich, based in Dresden, SN, DE, is currently a Senior Staff IC Packaging Engineer at Racyics. Michael Dittrich brings experience from previous roles at Fraunhofer IIS, SeeReal Technologies GmbH, Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS and ZMDI- Zentrum Mikroelektronik Dresden AG. Michael Dittrich holds a 2004 - 2010 Diploma in Information Engineering @ Technical University Dresden. With a robust skill set that includes Hardware Development, Altera Quartus, Signal Integrity, CST Microwave Studio, SPICE and more. Michael Dittrich has 3 emails on RocketReach.
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Top Racyics Employees
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Johannes Uhlig
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Florian Bilstein
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Thilo Wagner
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Dirk Bock
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Marcus Pietzsch
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Tobias Scheit
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Patrick Döll
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Jan Drobek
Analog Mixed-Signal IC Design Engineer at Racyics
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Anil Janumpally
SoC Architect and Technical Project Manager at Racyics
Hyderabad, TG, IN3 -
Michael Dittrich
Senior Staff IC Packaging Engineer at Racyics
Dresden, SN, DE3 -
Dmitry Osipov
Research And Development Engineer at Racyics
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Venkata Subrahmanyam
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