Michael Dittrich Email
Senior Staff IC Packaging Engineer @ Racyics
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Michael Dittrich Location
- Dresden, SN, DE
Michael Dittrich Work
- 2020 -now Senior Staff IC Packaging Engineer @
- 2012 -2020 Researcher @
- 2010 -2011 Design Engineer Systems @
- 2009 -2009 Working Student @
- 2008 -2008 Working Student @
- 2007 -2008 Working Student @ Technical University Dresden, Faculty of Computer Science, Institute for Compute
- 2004 -2004 Trainee @ Vattenfall Europe Information Services
Michael Dittrich Education
- Technical University Dresden
Diploma (Information Engineering)
2004-2010
Michael Dittrich Skills
- Hardware Development
- Altera Quartus
- Signal Integrity
- CST Microwave Studio
- SPICE
- Pcb Technologies
- Visual Studio
- Mentor Expedition
- FPGA prototyping
- Parasitic Extraction
- Xilinx ISE
- Verilog
- Chip Packaging
- FPGA
- VHDL
- Power Integrity
- C++
- Signalverarbeitung
- Computer Arithmetic
- C#
- Altium Designer
Michael Dittrich Summary
- Michael Dittrich, based in Dresden, SN, DE, is currently a Senior Staff IC Packaging Engineer at Racyics. Michael Dittrich brings experience from previous roles at Fraunhofer IIS, SeeReal Technologies GmbH, Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS and ZMDI- Zentrum Mikroelektronik Dresden AG. Michael Dittrich holds a 2004 - 2010 Diploma in Information Engineering @ Technical University Dresden. With a robust skill set that includes Hardware Development, Altera Quartus, Signal Integrity, CST Microwave Studio, SPICE and more. Michael Dittrich has 3 emails on RocketReach.
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