Michael Back Email & Phone Number
Principal Software Architect @ Teradyne
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Michael Back Location
- Taiwan
Michael Back Work
- 2025 - now Principal Software Architect @
- 2022 - 2025 Principal, Engineer and Manager @
- 2019 - 2022 Engineer, Senior Staff Manager @
- 2009 - 2019 Engineer, Senior Staff Manager @
- 2005 - 2009 Engineer, Senior Staff @
- 2003 - 2005 Field Applications Manager @
- 2001 - 2003 Field Applications Engineer @
- 2000 - 2001 Field Applications Engineer @
- 1995 - 2000 Product Test Engineer @
- 1995 - 2000 Product Test Engineer @
- 1990 - 1995 Test Engineer @
- 1988 - 1989 Test Engineer (Summer Internship) @
Michael Back Education
- Bob Jones University
Bachelors (Electronics Engineering)
1985 - 1990
Michael Back Skills
- Technical Presentations
- Microwave
- Analog
- Field Support
- RF
- Mixed Signal
- RF Engineering
- IC
- Engineering Management
- Automated Test
- Software Development
- Test Automation
- ANSI C
- VBA
- Awk
- Sed
- Python
- C++
- Shell Scripting
- Linux
- Test Engineering
- Wireless
- Perl
- SoC
- PCB design
- Testing
- Debugging
- CDMA
- Device Drivers
- Semiconductors
- LTE
- ASIC
- Embedded Software
- Spectrum Analyzer
- CMOS
- Circuit Design
- WCDMA
- Hardware
- Product Engineering
- Test Equipment
- Hardware Architecture
- Analog Circuit Design
- 3GPP
- Semiconductor Industry
- Silicon
- Embedded Systems
- Oscilloscope
- Digital Signal Processors
- Test Planning
- WAN
- Product Development
- Research
- Wireless Technologies
Michael Back Summary
- Michael Back, based in Taiwan, is currently a Principal Software Architect at Teradyne. Michael Back brings experience from previous roles at Qualcomm. Michael Back holds a 1985 - 1990 Bachelors in Electronics Engineering @ Bob Jones University. With a robust skill set that includes Technical Presentations, Microwave, Analog, Field Support, RF and more. Michael Back has 3 emails and 1 mobile phone numbers on RocketReach.
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Top Teradyne Employees
Ryan Driscoll
Vice President and General Counsel
North Reading, MA, US
Shannon Poulin
President - Semiconductor Test Division
United States
Mike Bradley
CEO
North Reading, MA, US
Jane Heffner
Vice President Sales - Americas
Detroit, MI, US
Bob Kenney
Vice President, Global Supply Chain and CPO
Oxford, ME, US
James Chang
Vice President Finance, Product Test Group
San Jose, CA, US
Ben Han
President of Memory Test Division
Mountain View, CA, US
Regan Mills
President, Product Test Division
Stoneham, MA, US
Craig Dowley
Chief Marketing Officer - Teradyne Robotics
Boston, MA, US
Shannon Gath
Chief Information Officer
Andover, MA, US
Greg Smith
President and CEO
Hopkinton, MA, US
Brian Amero
VP, Global Compliance and Ethics
North Reading, MA, US
John Wood
President, Systems Test Group
North Reading, MA, US
Young Kim
President, Memory Test Division
Saratoga, CA, US
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