Michael Back Email & Phone Number
Principal Software Architect @ Teradyne
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Michael Back Location
- Taiwan
Michael Back Work
- 2025 -now Principal Software Architect @
- 2022 -2025 Principal, Engineer and Manager @
- 2019 -2022 Engineer, Senior Staff Manager @
- 2009 -2019 Engineer, Senior Staff Manager @
- 2005 -2009 Engineer, Senior Staff @
- 2003 -2005 Field Applications Manager @
- 2001 -2003 Field Applications Engineer @
- 2000 -2001 Field Applications Engineer @
- 1995 -2000 Product Test Engineer @
- 1995 -2000 Product Test Engineer @
- 1990 -1995 Test Engineer @
- 1988 -1989 Test Engineer (Summer Internship) @
Michael Back Education
- Bob Jones University
Bachelors (Electronics Engineering)
1985-1990
Michael Back Skills
- Technical Presentations
- Microwave
- Analog
- Field Support
- RF
- Mixed Signal
- RF Engineering
- IC
- Engineering Management
- Automated Test
- Software Development
- Test Automation
- ANSI C
- VBA
- Awk
- Sed
- Python
- C++
- Shell Scripting
- Linux
- Test Engineering
- Wireless
- Perl
- SoC
- PCB design
- Testing
- Debugging
- CDMA
- Device Drivers
- Semiconductors
- LTE
- ASIC
- Embedded Software
- Spectrum Analyzer
- CMOS
- Circuit Design
- WCDMA
- Hardware
- Product Engineering
- Test Equipment
- Hardware Architecture
- Analog Circuit Design
- 3GPP
- Semiconductor Industry
- Silicon
- Embedded Systems
- Oscilloscope
- Digital Signal Processors
- Test Planning
- WAN
- Product Development
- Research
- Wireless Technologies
Michael Back Summary
- Michael Back, based in Taiwan, is currently a Principal Software Architect at Teradyne. Michael Back brings experience from previous roles at Qualcomm. Michael Back holds a 1985 - 1990 Bachelors in Electronics Engineering @ Bob Jones University. With a robust skill set that includes Technical Presentations, Microwave, Analog, Field Support, RF and more. Michael Back has 5 emails and 1 mobile phone numbers on RocketReach.
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Top Teradyne Employees
Ryan Driscoll
Vice President and General Counsel
North Reading, MA, US
Shannon Poulin
President - Semiconductor Test Division
United States
Ben Han
President of Memory Test Division
Mountain View, CA, US
Regan Mills
President, Product Test Division
Stoneham, MA, US
Justin Brown
Chief Commercial Officer - Teradyne Robotics
San Francisco, CA, US
Shannon Gath
Chief Information Officer
Andover, MA, US
Jean-Pierre Hathout
President of Teradyne Robotics
Brookline, MA, US
Joe Pasetti
VP, Global Government Relations
Washington, DC, US
Dennis Mauriello
Vice President Of Global Operations
North Reading, MA, US
Roy Chorev
VP Product Development, Semiconductor Test Division
Needham, MA, US
Ty Akin
VP of Global Sales
San Diego, CA, US
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