Mervin Concon Email
Senior Electrical and Electronic Engineer @ BESI Singapore Pte Ltd
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Mervin Concon Location
- Singapore
Mervin Concon Work
- 2022 -now Senior Electrical and Electronic Engineer @
- 2021 -2022 Senior EE engineer (R and D) @
- 2020 -2021 Senior EE engineer (R and D) @ HP Inc. Singapore HP Campus (SOHO2)
- 2018 -2020 Senior EE engineer (R and D) @ Cal-Comp Precision (Singapore) Limited.
- 2007 -2018 Senior Hardware Engineer @
- 2007 -2015 Hardware Engineer @
- 2006 -2007 Electronics Engineer @ ORIGO Research & Development
Mervin Concon Education
- University of San Carlos
Bachelor of Science in Electronics and Communication Engineering
1993-1996 - Holy Name University
Bachelor of Science in Electronics and Communication Engineering
1991-1993
Mervin Concon Skills
- Architectural Drafstman
- Spaceclaim
- PADS Layout
- Hardware Architecture
- RF
- Radio Frequency Rf
- C
- Debugging
- ARM
- PCB design
- Electronics
- Designsparkmechanical
- System Design
- Microcontrollers
- Engineering
- Bluetooth
- Circuit Design
- Debugging/Prototyping
- Rf Design And Optimisation
- Wireless Networking
- Embedded Systems
- Testing
- Design for Manufacturing
- 3D Modeling
- FPGA
- SoC
- Pads Logic
- Failure Analysis
- Firmware
- 3D Mechanical Parts Modeling And Designing
- Product Development
- Wireless
- Portrait Painting
- Hardware
- Radio Frequency
Mervin Concon Summary
- Mervin Concon, based in Singapore, is currently a Senior Electrical and Electronic Engineer at BESI Singapore Pte Ltd. Mervin Concon brings experience from previous roles at D&K Engineering, HP Inc. Singapore HP Campus (SOHO2), Cal-Comp Precision (Singapore) Limited. and RFNet Technologies Pte Ltd. Mervin Concon holds a 1993 - 1996 Bachelor of Science in Electronics and Communication Engineering @ University of San Carlos. With a robust skill set that includes Architectural Drafstman, Spaceclaim, PADS Layout, Hardware Architecture, RF and more. Mervin Concon has 1 emails on RocketReach.
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