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Mervin Concon Location
Singapore
Mervin Concon Work
Senior Electrical and Electronic Engineer @ (January 2022 - Present)
Senior EE engineer (R and D) @ (May 2021 - December 2022)
Senior EE engineer (R and D) @ HP Inc. Singapore HP Campus (SOHO2) (July 2020 - June 2021)
Senior EE engineer (R and D) @ Cal-Comp Precision (Singapore) Limited. (September 2018 - May 2020)
Senior Hardware Engineer @ (January 2007 - September 2018)
Hardware Engineer @ (January 2007 - April 2015)
Electronics Engineer @ ORIGO Research & Development (June 2006 - January 2007)
Mervin Concon Education
University of San Carlos
Bachelor of Science in Electronics and Communication Engineering
1993-1996
Holy Name University
Bachelor of Science in Electronics and Communication Engineering
1991-1993
Mervin Concon Skills
Architectural Drafstman
Spaceclaim
PADS Layout
Hardware Architecture
RF
Radio Frequency Rf
C
Debugging
ARM
PCB design
Electronics
Designsparkmechanical
System Design
Microcontrollers
Engineering
Bluetooth
Circuit Design
Debugging/Prototyping
Rf Design And Optimisation
Wireless Networking
Embedded Systems
Testing
Design for Manufacturing
3D Modeling
FPGA
SoC
Pads Logic
Failure Analysis
Firmware
3D Mechanical Parts Modeling And Designing
Product Development
Wireless
Portrait Painting
Hardware
Radio Frequency
Mervin Concon Summary
Mervin Concon, based in Singapore, is currently a Senior Electrical and Electronic Engineer at BESI Singapore Pte Ltd. Mervin Concon brings experience from previous roles at D&K Engineering, HP Inc. Singapore HP Campus (SOHO2), Cal-Comp Precision (Singapore) Limited. and RFNet Technologies Pte Ltd. Mervin Concon holds a 1993 - 1996 Bachelor of Science in Electronics and Communication Engineering @ University of San Carlos. With a robust skill set that includes Architectural Drafstman, Spaceclaim, PADS Layout, Hardware Architecture, RF and more. Mervin Concon has 1 emails on RocketReach.
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