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Meng Tan Location
Vancouver, WA, US
Meng Tan Work
2017 -now Engineer Principal, Process Integration @
2013 -2016 Module and Integration Yield Engineer @
2007 -2012 Graduate Research Assistant @
2012 -2012 Graduate Teaching Assistant @
2011 -2011 Graduate Technical Intern @
2008 -2008 Graduate Teaching Assistant @
2007 -2007 Graduate Teaching Assistant @
Meng Tan Education
University of Illinois at Urbana-Champaign
PhD (Electrical Engineering)
2009-2013
University of Illinois at Urbana-Champaign
MS (Electrical Engineering)
2007-2009
University of Illinois at Urbana-Champaign
BS (Electrical Engineering)
2003-2007
Meng Tan Skills
Matlab
Scanning Electron Microscopy
Semiconductor Lasers
RSoft
Photonic Crystals
Semiconductor Fabrication
L-Edit
Photolithography
Optical Communications
Compound Semiconductors
Radio Frequency Engineering
Semiconductors
CVD
Simulations
C++
Nanotechnology
LabVIEW
Silicon Photonics
MathCAD
NI LabVIEW
Sputter Deposition
Electron Beam Evaporation
Thermal Evaporation
PECVD
Reactive Ion Etching
Inductively Coupled Plasma
Thermal Oxidation
Profilometer
Ellipsometry
Probe Station
Network Analyzer
Oscilloscope
Optics
Research
Technology Transfer
Team Leadership
Project Management
Fiber Optics
WDM
FDTD
Monte Carlo Simulation
Java
SQL
Statistical Data Analysis
SPC
JMP
Microsoft Office
Physics
Testing
Python
L Edit
Meng Tan Summary
Meng Tan, based in Vancouver, WA, US, is currently a Engineer Principal, Process Integration at TSMC. Meng Tan brings experience from previous roles at Intel Corporation and University of Illinois at Urbana-Champaign. Meng Tan holds a 2009 - 2013 PhD in Electrical Engineering @ University of Illinois at Urbana-Champaign. With a robust skill set that includes Matlab, Scanning Electron Microscopy, Semiconductor Lasers, RSoft, Photonic Crystals and more. Meng Tan has 2 emails and 2 mobile phone numbers on RocketReach.
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