Max Wu Email

Platform Manager - External Packaging @ Intel Corporation

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Max Wu's Location

Hsinchu, TW

Max Wu's Work

Platform Manager - External Packaging @ Intel Corporation
Packaging Process Integration, Program Manager @ TSMC
Communication Product Packaging, Sr. Engr. @ Infineon Technologies

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Packaging House RD, Sr. Engr. @ Vate Technology

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Max Wu's Education

國立清華大學

Max Wu's Summary

Max Wu, based in Hsinchu, TW, is currently a Platform Manager - External Packaging at 英特爾, bringing experience from previous roles at TSMC, Infineon Technologies and Vate Technology. Max Wu holds a 國立清華大學. Max Wu has 2 emails on RocketReach.

Max Wu Email Address

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