Max Wu Email
Advanced Packaging 2.5D and 3D Platform Management - Technical Director @ Intel Corporation
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Max Wu Location
- Taiwan
Max Wu Work
- Advanced Packaging 2.5D and 3D Platform Management - Technical Director @ (September 2021 - Present)
- Packaging Process Integration, Program Manager @ (December 2007 - September 2021)
- Communication Product Packaging, Sr. Engr. @ (November 2004 - December 2007)
- Packaging House RD, Sr. Engr. @ Vate Technology (October 2000 - October 2004)
Max Wu Education
- National Tsing Hua University
Doctor of Philosophy - PhD (Power Mechanical Engineering)
Max Wu Skills
- Food Packaging
- Packaging Engineering
- Tracepro
- Touch Screens
- IC
Max Wu Summary
- Max Wu, based in Taiwan, is currently a Advanced Packaging 2.5D and 3D Platform Management - Technical Director at 英特爾. Max Wu brings experience from previous roles at TSMC, Infineon Technologies and Vate Technology. Max Wu holds a Doctor of Philosophy - PhD in Power Mechanical Engineering @ National Tsing Hua University. With a robust skill set that includes Food Packaging, Packaging Engineering, Tracepro, Touch Screens, IC and more. Max Wu has 4 emails on RocketReach.
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