If you need more lookups,
subscriptions start at $34 USD/month.
Matthew Tomback Location
Dillon, CO, US
Matthew Tomback Work
Principal Embedded Engineer @ (September 2019 - Present)
IoT Device Engineer @ Colca (June 2018 - August 2019)
Research Associate II - Engineer @ UIC ORBITLab (March 2018 - August 2019)
Regulatory Affairs Associate @ (March 2016 - February 2018)
Library Attendant @ (August 2011 - May 2015)
Drug Product Development Intern @ (June 2014 - August 2014)
Robotics Instructor @ RobotCity Workshop (June 2013 - August 2013)
Matthew Tomback Education
University of Illinois Chicago
Master of Science - MS (Bioengineering)
2017-2019
University of Southern California
Bachelor of Science - BS (Biomedical/Medical Engineering)
2011-2015
Vernon Hills High School 2007-2011
Matthew Tomback Skills
3D Printing
Bluetooth Low Energy (BLE)
C/C++
Circuit Design
Computer-Aided Design (CAD)
Embedded Software
Embedded Systems
Finite Element Analysis
Firmware Development
HPLC
Injection Molding
LabVIEW
Linux
Matlab
Microcontrollers
Microsoft Excel
Microsoft Office
Particle Imaging
Photoplethysmography (PPG)
Printed Circuit Board (PCB) Design
Python (Programming Language)
Rapid Prototyping
Research
Signal Processing
Statistics
Wearables
Matthew Tomback Summary
Matthew Tomback, based in Dillon, CO, US, is currently a Principal Embedded Engineer at Neopenda. Matthew Tomback brings experience from previous roles at Colca, UIC ORBITLab, Abbott and University of Southern California. Matthew Tomback holds a 2017 - 2019 Master of Science - MS in Bioengineering @ University of Illinois Chicago. With a robust skill set that includes 3D Printing, Bluetooth Low Energy (BLE), C/C++, Circuit Design, Computer-Aided Design (CAD) and more. Matthew Tomback has 1 emails and 1 mobile phone numbers on RocketReach.
Looking for a different Matthew Tomback?
Find contact details for 700 million professionals.