Senior Principal Engineer, Packaging Technology Lead (R and D) @ Fingerprint Cards
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Mats Slottner Location
Gothenburg, SE
Mats Slottner Work
2023 -
now Senior Principal Engineer, Packaging Technology Lead (R and D) @
2021 -
2023 Senior Director, Microelectronic Packaging Development (R and D) @
2019 -
2021 Senior Director, Optical and Packaging Systems Development (OPAS R and D) @
2018 -
2019 Senior Director, Microelectronic Packaging Development (R and D) @
2013 -
2018 Director Microelectronic Packaging Development @
2000 -
2013 Manager Advanced Packaging @
1999 -
2000 Head of R and D @ Radians Innova AB (acquired by Thorlabs in 2004)
1994 -
1999 Project Manager @ Radians Innova AB (acquired by Thorlabs in 2004)
1993 -
1994 Development Engineer @
Mats Slottner Education
Chalmers tekniska högskola
M.Sc.EE (Electronics)
1988
-
1992
Mats Slottner Skills
Start-ups
Mobile Devices
Product Management
Manufacturing
Semiconductors
Product Development
Biometrics
Customer Service
Microsoft Office
Marketing
JavaScript
Start Ups
Engineering
SQL
Packaging
Mats Slottner Summary
Mats Slottner, based in Gothenburg, SE, is currently a Senior Principal Engineer, Packaging Technology Lead (R and D) at Fingerprint Cards. Mats Slottner brings experience from previous roles at Fingerprint Cards. Mats Slottner holds a 1988 - 1992 M.Sc.EE in Electronics @ Chalmers tekniska högskola. With a robust skill set that includes Start-ups, Mobile Devices, Product Management, Manufacturing, Semiconductors and more. Mats Slottner has 1 emails and 1 mobile phone numbers on RocketReach.
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