Martin Trucco's Location
Neenah, WI, US
Martin Trucco's Work
Martin Trucco's Education
University of Wisconsin-Stout
Bachelor's degree (Packaging Science)
1981 - 1987
Glyndŵr University
College of Art and Design, International Studies, NEWI
1983 - 1983
Wausau Newman
High School (12)
1977 - 1981
Martin Trucco's Skills
Martin Trucco's Summary
Martin Trucco, based in Neenah, WI, US, is currently a Packaging Engineer, Applications Engineer at Esko, bringing experience from previous roles at Norka Inc., Visual Pak, Inspexpro and Digital POP Solutions, LLC (DigiPOPs!) A Jay Werthheimer Company. Martin Trucco holds a 1981 - 1987 Bachelor's degree in Packaging Science @ University of Wisconsin-Stout. With a robust skill set that includes Folding Cartons, Packaging, Packaging Design, ArtiosCAD, Product Development and more, Martin Trucco contributes valuable insights to the industry. Martin Trucco has 1 email and 1 mobile phone number on RocketReach.