Mario Vidal's Location
Columbus, OH, US
Mario Vidal's Work
Mario Vidal's Education
University of Washington Tacoma
Bachelor of Science - BS (Computer Science and Systems)
2021 - 2023
Highline College
Associate of Science - AS (Computer Science)
2019 - 2021
Universidad Centroamericana 'José Simeón Cañas'
(Computer Science)
1999 - 2006
Mario Vidal's Skills
Mario Vidal's Summary
Mario Vidal, based in Columbus, OH, US, is currently a Software Engineer at JPMorgan Chase & Co., bringing experience from previous roles at Revature, The Thunderword, Highline College, Freelance Web Development and National Administration of Water and Sewer. Mario Vidal holds a 2021 - 2023 Bachelor of Science - BS in Computer Science and Systems @ University of Washington Tacoma. With a robust skill set that includes Management, Telecomunicaciones, Microsoft Excel, Liderazgo de equipos and more, Mario Vidal contributes valuable insights to the industry. Mario Vidal has 2 emails on RocketReach.