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Mario Traeber Location
Singapore
Mario Traeber Work
VP of Engineering @ (August 2020 - Present)
General Manager R and D @ (March 2020 - August 2020)
Head of R and D SOC @ (November 2015 - August 2020)
Senior Director R and D @ (October 2010 - November 2015)
Senior Principal Engineer @ (January 2010 - October 2010)
Principal Engineer @ (January 2005 - February 2010)
Senior Engineer @ (January 2002 - January 2005)
Engineer @ (January 1999 - January 2002)
Mario Traeber Education
Technische Universität Dresden
Diploma (Electrical Engineering)
1994-1999
Mario Traeber Skills
ASIC
Analog
DSP
Digital Signal Processors
EDA
Embedded Software
Embedded Systems
Firmware
Functional Verification
Hardware Architecture
IC
Mixed Signal
PHY
R&D
RTL design
Semiconductor Industry
Semiconductors
Signal Processing
SoC
System on a Chip (SoC)
VLSI
System On A Chip Soc
Business Analysis
Engineering
Strategy
Program Management
Management
German
Integration
System on a Chip
Mario Traeber Summary
Mario Traeber, based in Singapore, is currently a VP of Engineering at MaxLinear. Mario Traeber brings experience from previous roles at Intel Corporation and Lantiq. Mario Traeber holds a 1994 - 1999 Diploma in Electrical Engineering @ Technische Universität Dresden. With a robust skill set that includes ASIC, Analog, DSP, Digital Signal Processors, EDA and more. Mario Traeber has 1 emails and 1 mobile phone numbers on RocketReach.
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