Maria Webb Email
Packaging Engineer @ KIND
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Maria Webb Location
- Chicago, IL, US
Maria Webb Work
- Packaging Engineer @ (January 2026 - Present)
- Packaging Engineer @ (September 2023 - January 2026)
- Structural Designer @ (May 2022 - September 2023)
- Design Associate @ (June 2021 - May 2022)
- Vice President of MSU CoPPAC @ (December 2020 - April 2021)
- Social Chair of MSU CoPPAC @ (August 2020 - December 2020)
- Packaging R and D Co-Op @ (January 2020 - June 2020)
- Secretary of MSU CoPPAC @ (August 2019 - December 2019)
- Structural Designer Intern @ (April 2019 - August 2019)
- Assistant Quality Control Manager @ (April 2018 - August 2018)
- Shipping and Receiving Specialist and Warehouse Worker @ (June 2017 - August 2017)
Maria Webb Education
- Michigan State University
Master of Science - MS (Packaging Science)
2021-2023 - Michigan State University
Bachelor's (Packaging Science)
2017-2021 - Gabriel Richard Catholic High School
High School Diploma
2013-2017
Maria Webb Summary
- Maria Webb, based in Chicago, IL, US, is currently a Packaging Engineer at KIND. Maria Webb brings experience from previous roles at TreeHouse Foods, International Paper and MSU School of Packaging. Maria Webb holds a 2021 - 2023 Master of Science - MS in Packaging Science @ Michigan State University. Maria Webb has 3 emails on RocketReach.
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