Maria Webb Email
Packaging Engineer @ KIND
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Maria Webb Location
- Chicago, IL, US
Maria Webb Work
- 2026 -now Packaging Engineer @
- 2023 -2026 Packaging Engineer @
- 2022 -2023 Structural Designer @
- 2021 -2022 Design Associate @
- 2020 -2021 Vice President of MSU CoPPAC @
- 2020 -2020 Social Chair of MSU CoPPAC @
- 2020 -2020 Packaging R and D Co-Op @
- 2019 -2019 Secretary of MSU CoPPAC @
- 2019 -2019 Structural Designer Intern @
- 2018 -2018 Assistant Quality Control Manager @
- 2017 -2017 Shipping and Receiving Specialist and Warehouse Worker @
Maria Webb Education
- Michigan State University
Master of Science - MS (Packaging Science)
2021-2023 - Michigan State University
Bachelor's (Packaging Science)
2017-2021 - Gabriel Richard Catholic High School
High School Diploma
2013-2017
Maria Webb Summary
- Maria Webb, based in Chicago, IL, US, is currently a Packaging Engineer at KIND. Maria Webb brings experience from previous roles at TreeHouse Foods, International Paper and MSU School of Packaging. Maria Webb holds a 2021 - 2023 Master of Science - MS in Packaging Science @ Michigan State University. Maria Webb has 3 emails on RocketReach.
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