Maria Webb Location
- Chicago, IL, US
Maria Webb Work
- 2026 - now Packaging Engineer @
- 2023 - 2026 Packaging Engineer @
- 2022 - 2023 Structural Designer @
- 2021 - 2022 Design Associate @
- 2020 - 2021 Vice President of MSU CoPPAC @
- 2020 - 2020 Social Chair of MSU CoPPAC @
- 2020 - 2020 Packaging R and D Co-Op @
- 2019 - 2019 Secretary of MSU CoPPAC @
- 2019 - 2019 Structural Designer Intern @
- 2018 - 2018 Assistant Quality Control Manager @
- 2017 - 2017 Shipping and Receiving Specialist and Warehouse Worker @
Maria Webb Education
- Michigan State University
Master of Science - MS (Packaging Science)
2021 - 2023 - Michigan State University
Bachelor's (Packaging Science)
2017 - 2021 - Gabriel Richard Catholic High School
High School Diploma
2013 - 2017
Maria Webb Summary
- Maria Webb, based in Chicago, IL, US, is currently a Packaging Engineer at KIND. Maria Webb brings experience from previous roles at TreeHouse Foods, International Paper and MSU School of Packaging. Maria Webb holds a 2021 - 2023 Master of Science - MS in Packaging Science @ Michigan State University. Maria Webb has 3 emails on RocketReach.
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