Marcel Hoehn Email
Sr. Engineering Manager - Assembly Technology Division @ Kyocera International, Inc. - Semiconductor Components Group
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Marcel Hoehn Location
- San Diego, CA, US
Marcel Hoehn Work
- 2025 -now Sr. Engineering Manager - Assembly Technology Division @
- 2022 -2025 Engineering Manager - Assembly Technology Division @
- 2021 -2022 Senior Process Engineer @
- 2020 -2021 Process Engineer @
- 2018 -2020 Engineer @
- 2016 -2017 Technical Manager @ HSE Bearings GmbH
Marcel Hoehn Education
- Ehrhart - Schott - Schule Schwetzingen
Bachelor of Engineering
2013-2017 - Ehrhart - Schott - Schule Schwetzingen
(Robotics, Mechatronics)
2009-2013
Marcel Hoehn Skills
- Continuous Process Improvement
- Interposer Fan Out (InFO)
- Silicon interposer
- TSV
- CoWoS
- Flip chip packaging
- PCB Assembly
- Design for Manufacturing
- Program Management
- Engineering Management
- Circuit card assembly
- Phased Array Board Assembly
- Large board assembly
- SMT
- Ipc 610
- Mil std 883
- Machine tooling / fixturing
- Advanced semiconductor packaging
- 2.5D packaging
- 3D Packaging
Marcel Hoehn Summary
- Marcel Hoehn, based in San Diego, CA, US, is currently a Sr. Engineering Manager - Assembly Technology Division at Kyocera International, Inc. - Semiconductor Components Group. Marcel Hoehn brings experience from previous roles at Kyocera International, Inc. - Semiconductor Components Group and KULR Technology Corporation. Marcel Hoehn holds a 2013 - 2017 Bachelor of Engineering @ Ehrhart - Schott - Schule Schwetzingen. With a robust skill set that includes Continuous Process Improvement, Interposer Fan Out (InFO), Silicon interposer, TSV, CoWoS and more. Marcel Hoehn has 2 emails on RocketReach.
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