Mandar Shinde Email & Phone Number
Packaging Engineer @ Intel Corporation
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Mandar Shinde Location
- Chandler, AZ, US
Mandar Shinde Work
- 2023 -now Packaging Engineer @
- 2018 -2023 Graduate Research Assistant @
- 2021 -2021 Stress Analysis Intern @
- 2020 -2020 Stress Analysis Intern @
- 2015 -2018 Crash CAE engineer @
- 2011 -2012 Assistant Manager @
Mandar Shinde Education
- Arizona State University
Doctor of Philosophy - PhD (Mechanical Engineering)
2018-2022 - Indian Institute of Technology, Bombay
Master of Technology (M.Tech.) (Engineering Design)
2013-2015 - COEP Technological University
Bachelor of Technology (B.Tech.) (Mechanical Engineering)
2007-2011
Mandar Shinde Skills
- LS-DYNA
- Hypermesh
- Primer Design
- Matlab
- Microsoft Office
- C++
- AutoCAD
- C
- Engineering
- Microsoft Excel
- Finite Element Analysis
- Solid Mechanics
- Fracture Mechanics
- Machine Design
- Automotive
- Abaqus
- Fortran
- Nastran
- Pro Engineer
- Ls Dyna
- PTC Creo
Mandar Shinde Summary
- Mandar Shinde, based in Chandler, AZ, US, is currently a Packaging Engineer at Intel Corporation. Mandar Shinde brings experience from previous roles at Arizona State University, NXP Semiconductors and Tata Motors. Mandar Shinde holds a 2018 - 2022 Doctor of Philosophy - PhD in Mechanical Engineering @ Arizona State University. With a robust skill set that includes LS-DYNA, Hypermesh, Primer Design, Matlab, Microsoft Office and more. Mandar Shinde has 4 emails and 1 mobile phone numbers on RocketReach.
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