Maggie Hu's Location

Santa Clara, CA, US

Maggie Hu's Work

  • Hardware Technology Intern @ Apple

Maggie Hu's Education

  • UCLA

    2010 - 2015
  • 2012 Dielectric EAP training school - Neuchatel, Switzerland

    (Electroactive Polymers)

    2012 - 2012
  • Tsinghua University

    Bachelor (Chemical Engineering)

    2006 - 2010
  • Shenzhen Senior High School

    2003 - 2006

Maggie Hu's Skills

  • LCR
  • Packaging
  • Social Media
  • Materials Science
  • Dynamic Mechanical
  • Scanning Electron Microscopy
  • Matlab
  • Data Analysis
  • GPC
  • TEM

Maggie Hu's Summary

Maggie Hu, based in Santa Clara, CA, US, is currently a IC Packaging Engineer at Apple, bringing experience from previous roles at UCLA and Apple. Maggie Hu holds a 2010 - 2015 UCLA. With a robust skill set that includes LCR, Packaging, Social Media, Materials Science, Dynamic Mechanical and more, Maggie Hu contributes valuable insights to the industry. Maggie Hu has 2 emails on RocketReach.

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