Logan Blake Email
Technology Development Engineer (Advanced Packaging Defect Metrology and Reduction) @ Intel Corporation
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Logan Blake Location
- Chicago, IL, US
Logan Blake Work
- Technology Development Engineer (Advanced Packaging Defect Metrology and Reduction) @ (July 2024 - Present)
- Factory Startup Process Engineer (Advanced Packaging and Test) @ (December 2021 - June 2024)
- Technology Development Engineer (Silicon Photonics Reliability) @ (May 2021 - December 2021)
- Yield Engineer (Process Integration and Device) @ (February 2019 - May 2021)
- New Mexico Tech Head Rugby Coach @ (February 2019 - May 2019)
- Student Polar Engineer @ (May 2017 - February 2019)
- Engineering Intern (Process Integration and Device) @ (May 2016 - December 2016)
Logan Blake Education
- New Mexico Institute of Mining and Technology
Master of Engineering - MEng (Materials Engineering)
2020-2025 - New Mexico Institute of Mining and Technology
Bachelor's degree (Chemical Engineering)
2015-2019
Logan Blake Summary
- Logan Blake, based in Chicago, IL, US, is currently a Technology Development Engineer (Advanced Packaging Defect Metrology and Reduction) at Intel Corporation. Logan Blake brings experience from previous roles at Intel Corporation and New Mexico Institute of Mining and Technology. Logan Blake holds a 2020 - 2025 Master of Engineering - MEng in Materials Engineering @ New Mexico Institute of Mining and Technology. Logan Blake has 3 emails on RocketReach.
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