Technology Development Engineer (Advanced Packaging Defect Metrology and Reduction) @ Intel Corporation
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Logan Blake Location
Chicago, IL, US
Logan Blake Work
2024 -now Technology Development Engineer (Advanced Packaging Defect Metrology and Reduction) @
2021 -2024 Factory Startup Process Engineer (Advanced Packaging and Test) @
2021 -2021 Technology Development Engineer (Silicon Photonics Reliability) @
2019 -2021 Yield Engineer (Process Integration and Device) @
2019 -2019 New Mexico Tech Head Rugby Coach @
2017 -2019 Student Polar Engineer @
2016 -2016 Engineering Intern (Process Integration and Device) @
Logan Blake Education
New Mexico Institute of Mining and Technology
Master of Engineering - MEng (Materials Engineering)
2020-2025
New Mexico Institute of Mining and Technology
Bachelor's degree (Chemical Engineering)
2015-2019
Logan Blake Summary
Logan Blake, based in Chicago, IL, US, is currently a Technology Development Engineer (Advanced Packaging Defect Metrology and Reduction) at Intel Corporation. Logan Blake brings experience from previous roles at Intel Corporation and New Mexico Institute of Mining and Technology. Logan Blake holds a 2020 - 2025 Master of Engineering - MEng in Materials Engineering @ New Mexico Institute of Mining and Technology. Logan Blake has 3 emails on RocketReach.
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