Loan Ho Email
Senior Packaging Designer @ Billie
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Loan Ho Location
- New York, NY, US
Loan Ho Work
- Senior Packaging Designer @ (February 2026 - Present)
- Packaging Designer @ (November 2024 - February 2026)
- Packaging Designer @ (June 2022 - October 2024)
- Industrial Design Tutor @ (June 2020 - June 2022)
- Studio Resource Librarian @ Billy Cotton (January 2022 - May 2022)
- Packaging Design Intern @ (May 2021 - August 2021)
- PreCollege Studio Mentor @ (June 2019 - July 2019)
- Intern @ Andrew F. Anderson Structural Engineer (June 2018 - August 2018)
Loan Ho Education
- Pratt Institute
Bachelor of Industrial Design (Industrial Design, minor in Fashion Design)
Loan Ho Summary
- Loan Ho, based in New York, NY, US, is currently a Senior Packaging Designer at Billie. Loan Ho brings experience from previous roles at Glossier, Inc., Clinique, Pratt Institute and Billy Cotton. Loan Ho holds a Bachelor of Industrial Design in Industrial Design, minor in Fashion Design @ Pratt Institute. Loan Ho has 1 emails on RocketReach.
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