Liwei Wang Email

Director, 3D Advanced Packaging @ AMD

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Liwei Wang's Location

Chandler, Arizona, United States

Liwei Wang's Work

Director, 3D Advanced Packaging @ AMD
Principal Engineer and Director, Assembly and Test Program Manager - Intel3 and 4 Server and Networking Products @ Intel Corporation
Senior Technical Program Manager, Advanced 2.5D and 3D Packaging Integration @ Intel Corporation

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Senior Technical Program Manager, SiP Technology Integration @ Intel Corporation
Technical Program Manager, 3D Packaging Technology Integration @ Intel Corporation
Sr. and Staff Packaging Engineer @ Intel Corporation

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Liwei Wang's Education

Auburn University
Doctor of Philosophy (Ph.D.) (Materials Science and Engineering)
2001 - 2007
East China University of Science and Technology
Bachelor's degree (Materials Science and Engineering)
1997 - 2001

Liwei Wang's Skills

Matlab
Research and Development R&d
Statistical Process Control Spc

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Simulations
Semiconductors
Integrated Circuits Ic
Semiconductor Industry
SPC
Failure Analysis
Design of Experiments

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Liwei Wang's Summary

Liwei Wang, based in Chandler, Arizona, United States, is currently a Director, 3D Advanced Packaging at AMD, bringing experience from previous roles at Intel Corporation. Liwei Wang holds a 2001 - 2007 Doctor of Philosophy (Ph.D.) in Materials Science and Engineering @ Auburn University. With a robust skill set that includes Matlab, Research and Development R&d, Statistical Process Control Spc, Simulations, Semiconductors and more, Liwei Wang contributes valuable insights to the industry. Liwei Wang has 3 emails on RocketReach.

Liwei Wang Email Address

Found 3 email address listings:

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