Director, 3D Advanced Packaging @ (June 2022 - June 2025)
Principal Engineer and Director, Assembly and Test Program Manager - Intel3 and 4 Server and Networking Products @ (January 2020 - May 2022)
Senior Technical Program Manager, Advanced 2.5D and 3D Packaging Integration @ (July 2017 - December 2019)
Senior Technical Program Manager, SiP Technology Integration @ (January 2015 - June 2017)
Technical Program Manager, 3D Packaging Technology Integration @ (January 2014 - December 2014)
Sr. and Staff Packaging Engineer @ (October 2008 - December 2013)
Liwei Wang Education
Auburn University
Doctor of Philosophy (Ph.D.) (Materials Science and Engineering)
2001-2007
East China University of Science and Technology
Bachelor's degree (Materials Science and Engineering)
1997-2001
Liwei Wang Skills
Characterization
Materials Science
Semiconductors
Design of Experiments
Failure Analysis
Thin Films
Simulations
SPC
Manufacturing
R&D
Semiconductor Industry
Research and Development (R&D)
Integrated Circuits (IC)
Statistical Process Control (SPC)
JMP
Matlab
Research and Development R&d
Statistical Process Control Spc
Integrated Circuits Ic
Research and Development
Integrated Circuits
Statistical Process Control
Liwei Wang Summary
Liwei Wang, based in Austin, TX, US, is currently a Sr. Director, Heterogeneous Integration Foundry Technology Development at AMD. Liwei Wang brings experience from previous roles at AMD and Intel Corporation. Liwei Wang holds a 2001 - 2007 Doctor of Philosophy (Ph.D.) in Materials Science and Engineering @ Auburn University. With a robust skill set that includes Characterization, Materials Science, Semiconductors, Design of Experiments, Failure Analysis and more. Liwei Wang has 2 emails and 1 mobile phone numbers on RocketReach.
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