Senior Claims Counsel @ (March 2018 - January 2020)
Associate Attorney @ (December 2014 - January 2020)
Associate @ (June 2011 - December 2014)
Associate @ (September 2008 - June 2011)
Law Clerk @ Cremer Kopon Shaughnessy & Spina (May 2007 - September 2008)
Lindsay Boyd Education
University of Illinois Chicago School of Law 2005-2008
University of Missouri-Columbia
Political Science (History Minor)
2000-2004
Lindsay Boyd Skills
Civil Litigation
Appeals
Arbitration
Civil Law
Commercial Litigation
Courts
Legal Research
Legal Writing
Liability
Litigation
Lindsay Boyd Summary
Lindsay Boyd, based in Chicago, IL, US, is currently a Vice President, Cyber Claims at Ambridge Group. Lindsay Boyd brings experience from previous roles at Hiscox USA, ESIS ProClaim, BatesCarey LLP and Cassiday Schade LLP. Lindsay Boyd holds a 2005 - 2008 University of Illinois Chicago School of Law. With a robust skill set that includes Civil Litigation, Appeals, Arbitration, Civil Law, Commercial Litigation and more. Lindsay Boyd has 1 emails and 2 mobile phone numbers on RocketReach.
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