Liang Wang Email & Phone Number

Liang Wang Skills

• die attach, CMOS image sensor pixel engineering, photonic imaging data acquisition and analysis, biological functionalization
• 3D packaging, wirebond, die attach, injection molding
• packaging, PCB assembly, wirebond, injection molding, microfluidic flow cell, water-proof sealing
• Design, DFT, DFM, DFR, wafer fab, IC package, assembly, test, process integration, failure analysis, metrology, yield and reliability improvement
• Sensor, OLED, device design, fabrication, encapsulation, functional testing
• 3D packaging, FlipChip, TCB, wirebond, die attach, injection molding
• Advanced Packaging 2.5/ 3D IC, Chiplet, FI / FOWLP, Si Photonics, FlipChip, TCB, wirebond
• Phase-gated plan, design, FEMA, DFT, DFM, DFR, fab, PCBA test, RCA, QC, yield, reliability
• Technology strategy & roadmap, assessment, budget plan, execution, risk control
• Design, functional test, DFT, DFR, DFM, CIS, LED / OLED, sensor
• Advanced packaging, 2.5D / 3D IC, Hybrid bond W2W D2W, TSV, µ-Cu Pillar,TCB, SMT, PCB, SiP, MCM, WLP, assembly
• design, FMEA, system testing, microfluidics, software
• System integration, design, FMEA, DFT, wafer fab, IC package, assembly, process integration, testing, metrology, failure analysis, yield & reliability improvement,
• Sensor, medical device (Class II ), MEMS, Flipchip, TCB
• Cross-functional lead, strategic roadmap, program & risk management, supply chain management, business processes, Jira, Confluence
• Mixed-signal ASIC design, pA-level amperometric measurement of DNA thru nanopore
• System integration, design, assembly, testing, metrology, failure analysis, reliability, Sensor, medical device, CIS, MEMS, LED/OLED, Si Ph, 3D IC, Flip chip, DFR, DFM
• Cross-functional lead, program management, business plan, investment strategy, Value proposition, market analysis, cost model, pricing, IP portfolio, tech transfer, Customer interaction, multilateral communication, technical / business presentation
• Wafer fab, IC package, assembly, test, process integration, metrology, FA, reliability, Sensor, medical device, MEMS, CIS, LED/OLED, Flipchip, WLP, 2.5 /3D, DFR, DFM
• Cross-functional lead, program management, business plan, investment strategy, Value proposition, market analysis, cost model, pricing, IP portfolio, tech transfer, Customer interaction, multilateral communication, technical / business presentation,
• Nanotechnology
• OLED
• Failure Analysis
• Metrology
• IC
• Device Design
• CMOS
• Fabrication
• Characterization
• Electronics
• Cross-functional Team Leadership
• Device Physics
• Semiconductors
• Materials Science
• Thin Films
• Nanomaterials
• Device Characterization
• Microelectronics
• Materials
• Nanoparticles
• Sensors
• XRD
• Semiconductor Manufacturing
• AFM
• Nanofabrication
• Electron Beam Lithography
• CVD
• Etching
• Surface
• Optics
• Power Management
• Process Integration
• FIB
• Photolithography
• Yield Enhancement
• R&D
• Spectroscopy
• Metal Fabrication
• Optoelectronics
• Physics
• Silicon
• Design of Experiments
• MEMS
• Product Development
• Research and Development (R&D)
• Design of Experiments (DOE)
• Leadership
• Cross Functional Team Leadership
• Data Analysis
• Management
• Research and Development R&d
• Testing
• Research and Development