Liang Li's Location
Shanghai, China
Liang Li's Work
- Senior Director of 3D NAND Development @ Western Digital
- Director of 3D NAND product development engineering @ SanDisk®
- Senior Manager, Product Development Engineering @ SanDisk®
- Principle Product development engineer @ SanDisk®
- Product development engineer @ Micron Technology
- Quality and reliability engineer @ Intel Corporation
- Process integration engineer @ Grace Semiconductor Manufacturing Corporation
Liang Li's Education
- Tongji University
硕士 (Materials Science)
2001 - 2003
Liang Li's Skills
- Semiconductors
- Process Integration
- Semiconductor Industry
- Flash Memory
- IC
- Semiconductor Failure Analysis
- Failure Analysis
- Reliability
- Silicon
- Product Development
Liang Li's Summary
Liang Li, based in Shanghai, China, is currently a Senior Director of 3D NAND Development at Western Digital, bringing experience from previous roles at 闪迪, SanDisk and Micron Technology. Liang Li holds a 2001 - 2003 硕士 in Materials Science @ Tongji University. With a robust skill set that includes Semiconductors, Process Integration, Semiconductor Industry, Flash Memory, IC and more, Liang Li contributes valuable insights to the industry. Liang Li has 2 emails on RocketReach.
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