Liana Jackson, based in Boise, ID, US, is currently a Senior Advanced Packaging Manufacturing Engineer at American Semiconductor. Liana Jackson brings experience from previous roles at Micron Technology. Liana Jackson holds a 2001 - 2010 BSMSE in Materials Science & Engineering, Phyics, Mathematics, Biomaterials @ Boise State University. With a robust skill set that includes Semiconductors, Java, Project Management, Lean Manufacturing, Manufacturing and more. Liana Jackson has 1 emails and 1 mobile phone numbers on RocketReach.
Looking for a different Liana Jackson?
Find contact details for 700 million professionals.