Leonard Bugla Email
Support- and Applikationsingenieur @ Klippel GmbH
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Leonard Bugla Location
- Dresden, SN, DE
Leonard Bugla Work
- 2024 -now Support- and Applikationsingenieur @
- 2023 -2024 Diplomand @
- 2022 -2023 Praktikant @
Leonard Bugla Education
- Technische Universität Dresden
Diplom-Ingenieur (Electrical, Electronics and Communications Engineering)
2016-2024
Leonard Bugla Summary
- Leonard Bugla, based in Dresden, SN, DE, is currently a Support- and Applikationsingenieur at Klippel GmbH. Leonard Bugla brings experience from previous roles at Klippel GmbH. Leonard Bugla holds a 2016 - 2024 Diplom-Ingenieur in Electrical, Electronics and Communications Engineering @ Technische Universität Dresden. Leonard Bugla has 1 emails on RocketReach.
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Leonard Bugla
Support- and Applikationsingenieur
Dresden, SN, DE
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