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Leonard Bugla Location
Dresden, SN, DE
Leonard Bugla Work
Support- and Applikationsingenieur @ (June 2024 - Present)
Diplomand @ (October 2023 - May 2024)
Praktikant @ (November 2022 - May 2023)
Leonard Bugla Education
Technische Universität Dresden
Diplom-Ingenieur (Electrical, Electronics and Communications Engineering)
2016-2024
Leonard Bugla Summary
Leonard Bugla, based in Dresden, SN, DE, is currently a Support- and Applikationsingenieur at Klippel GmbH. Leonard Bugla brings experience from previous roles at Klippel GmbH. Leonard Bugla holds a 2016 - 2024 Diplom-Ingenieur in Electrical, Electronics and Communications Engineering @ Technische Universität Dresden. Leonard Bugla has 1 emails on RocketReach.
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