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Lei Yan Location
United States
Lei Yan Work
Engineering @ (August 2025 - Present)
Engineering @ (January 2024 - August 2025)
Director of Engineering @ (January 2023 - January 2024)
Senior Engineering Manager @ (January 2022 - January 2023)
Senior Engineering Manager @ (September 2020 - February 2022)
Staff Engineer @ (August 2018 - September 2020)
Senior Software Engineer @ (December 2015 - August 2018)
Lei Yan Education
Carnegie Mellon University
Master of Science (MS)
2012-2014
Northeastern University (CN)
Bachelor of Science (BS) (Computer Science)
2008-2012
Lei Yan Skills
Android
Assembly Language
HTML
J2EE Application Development
Java
JavaScript
Linux
Python
SQL
Lei Yan Summary
Lei Yan, based in United States, is currently a Engineering at HopNow. Lei Yan brings experience from previous roles at Reshop, Block and Afterpay. Lei Yan holds a 2012 - 2014 Master of Science (MS) @ Carnegie Mellon University. With a robust skill set that includes Android, Assembly Language, HTML, J2EE Application Development, Java and more. Lei Yan has 2 emails and 1 mobile phone numbers on RocketReach.
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