Lei Fu Email & Phone Number

Lei Fu Skills

• Foundries and OSATs management, BOM characterization and qualification, Fab BEOL and FBEOL process
• Advanced packaging (2.5D/3D, Si bridge, InFO, wafer level fan out) integration and process development, design rule definition and TV design, NPI,C4/ubum bumping, flip chip assembly, Si to package integration, EM, Chiplet architecture definition and integration
• Semiconductors
• IC
• Failure Analysis
• CMOS
• Silicon
• Microprocessors
• Product Engineering
• Simulations
• Design of Experiments
• JMP
• Reliability
• MEMS
• Semiconductor Industry
• Characterization
• System on a Chip (SoC)
• Application-Specific Integrated Circuits (ASIC)
• Engineering Management
• Testing
• SoC
• Metrology
• Electronics
• Process Engineering
• Leadership
• Customer Service
• Mixed Signal
• PCB design
• Process Simulation
• Integration
• Engineering
• Management
• Embedded Systems
• Product Development
• Verilog
• Six Sigma
• Field Programmable Gate Arrays Fpga
• Program Management
• Materials Science
• Process Integration
• Statistical Process Control Spc
• Application Specific Integrated Circuits Asic
• Cross Functional Team Leadership
• EDA
• Matlab
• Very Large Scale Integration Vlsi
• Debugging
• Teaching
• Physics
• Processors
• Research and Development R&d
• Thin Films
• Manufacturing
• System on a Chip Soc
• Yield
• Hardware Architecture
• Product Management
• Research and Development
• System on a Chip
• Very Large Scale Integration
• Statistical Process Control
• Application Specific Integrated Circuits
• Field Programmable Gate Arrays