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Lei du Location
Tokyo, JP
Lei du Work
2025 -now Lead Product Manager @
2023 -2025 Senior Product Manager @
2021 -2023 Product Manager @
2019 -2021 Consumer Payment Program Manager @
2018 -2019 Java Software Development Team Lead @
2014 -2018 Assistant Manager @
2011 -2013 Payment Application Developer @
Lei du Education
Harbin University of Science and Technology
Master's degree (Computer Science and Technology)
2008-2011
Harbin University of Science and Technology
Bachelor's degree (Software Engineering)
2004-2008
Lei du Skills
Leadership
Linux
Payment Gateways
Payments
MongoDB
Spring MVC
Payment Industry
Online Payment
MyBatis
Oracle
Payment Systems
Java
Training
JavaScript
Spring Framework
Management
PCI DSS
Electronic Payments
MySQL
Amazon Web Services Aws
Lpic
Amazon Web Services
Lei du Summary
Lei du, based in Tokyo, JP, is currently a Lead Product Manager at PayPal. Lei du brings experience from previous roles at PayPal, Amazon and Touché. Lei du holds a 2008 - 2011 Master's degree in Computer Science and Technology @ Harbin University of Science and Technology. With a robust skill set that includes Leadership, Linux, Payment Gateways, Payments, MongoDB and more. Lei du has 2 emails on RocketReach.
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