Lee Williams's Location
Chicago, Illinois, United States
Lee Williams's Work
- Vice President of Lending @ Burling Bank
- Assistant Vice President @ Burling Bank
- Senior Loan Officer @ Morgan Stanley
- Assistant Vice President @ American Invsco
- Secondary Marketing Manager @ MidAmerica Bank
Lee Williams's Education
- William
(Liberal Arts, Human Physiology)
1980 - 1984
Lee Williams's Skills
- Financial Analysis
- Risk Management
- Customer Service
- Management
- Credit
- Banking
- Leadership
- Portfolio Management
- Credit Analysis
- Loans
Lee Williams's Summary
Lee Williams, based in Chicago, Illinois, United States, is currently a Vice President of Lending at Burling Bank, bringing experience from previous roles at Burling Bank, Morgan Stanley, American Invsco and Midamerica Bank. Lee Williams holds a 1980 - 1984 William. With a robust skill set that includes Financial Analysis, Risk Management, Customer Service, Management, Credit and more, Lee Williams contributes valuable insights to the industry. Lee Williams has 2 emails and 1 mobile phone number on RocketReach.
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