Lee Soon Email
Director of Package Design, Intel Malaysia, Architecture Design and Technology Solutions (since 2017) @ Intel Corporation
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Lee Soon Location
- Penang, Malaysia
Lee Soon Work
- Director of Package Design, Intel Malaysia, Architecture Design and Technology Solutions (since 2017) @ (January 2011 - Present)
- Technology Development Engineering Manager @ (January 2007 - December 2010)
- Package Design and Electrical Lead @ (January 2004 - December 2006)
- Package Design Engineer @ (September 2002 - December 2003)
- Subcontract Program Manager @ (February 2001 - August 2002)
- Microprocessor Failure Analysis Engineer @ (September 1998 - January 2001)
Lee Soon Education
- University of Hertfordshire
Electrical and Electronics Engineering (BEng)
1998
Lee Soon Skills
- CPU and Chipset Package Design
- IP Test Chip Package Design
- Assembly Test Vehicle Package Design
- Power Delivery
- Subcontracts Management
- Project Management
- Assembly Technology Development
- CPU and Chipset Package Designs
- IP Test Chips Package Designs
- Test Vehicle Package Designs
- Signal Integrity
- Manufacturing Subcontracting
- Semiconductor Industry
- Leadership
- People Management
- People Development
- Program Management
- Strategic Planning
- Operational Excellence
- Competitive Analysis
- Cost Reduction
- Failure Analysis
- Problem Solving
Lee Soon Summary
- Lee Soon, based in Penang, Malaysia, is currently a Director of Package Design, Intel Malaysia, Architecture Design and Technology Solutions (since 2017) at Intel Corporation. Lee Soon brings experience from previous roles at Intel Corporation. Lee Soon holds a Electrical and Electronics Engineering (BEng) @ University of Hertfordshire. With a robust skill set that includes CPU and Chipset Package Design, IP Test Chip Package Design, Assembly Test Vehicle Package Design, Power Delivery, Subcontracts Management and more. Lee Soon has 3 emails on RocketReach.
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