Lee Soon Email
Director of Package Design, Intel Malaysia, Architecture Design and Technology Solutions (since 2017) @ Intel Corporation
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Lee Soon Location
- Penang, Malaysia
Lee Soon Work
- 2011 -now Director of Package Design, Intel Malaysia, Architecture Design and Technology Solutions (since 2017) @
- 2007 -2010 Technology Development Engineering Manager @
- 2004 -2006 Package Design and Electrical Lead @
- 2002 -2003 Package Design Engineer @
- 2001 -2002 Subcontract Program Manager @
- 1998 -2001 Microprocessor Failure Analysis Engineer @
Lee Soon Education
- University of Hertfordshire
Electrical and Electronics Engineering (BEng)
1998
Lee Soon Skills
- CPU and Chipset Package Design
- IP Test Chip Package Design
- Assembly Test Vehicle Package Design
- Power Delivery
- Subcontracts Management
- Project Management
- Assembly Technology Development
- CPU and Chipset Package Designs
- IP Test Chips Package Designs
- Test Vehicle Package Designs
- Signal Integrity
- Manufacturing Subcontracting
- Semiconductor Industry
- Leadership
- People Management
- People Development
- Program Management
- Strategic Planning
- Operational Excellence
- Competitive Analysis
- Cost Reduction
- Failure Analysis
- Problem Solving
Lee Soon Summary
- Lee Soon, based in Penang, Malaysia, is currently a Director of Package Design, Intel Malaysia, Architecture Design and Technology Solutions (since 2017) at Intel Corporation. Lee Soon brings experience from previous roles at Intel Corporation. Lee Soon holds a Electrical and Electronics Engineering (BEng) @ University of Hertfordshire. With a robust skill set that includes CPU and Chipset Package Design, IP Test Chip Package Design, Assembly Test Vehicle Package Design, Power Delivery, Subcontracts Management and more. Lee Soon has 3 emails on RocketReach.
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