Lee Siong Email & Phone Number
Senior Process Wire Bonding Engineer @ STMicroelectronics
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Lee Siong Location
- Singapore
Lee Siong Work
- 2019 -now Senior Process Wire Bonding Engineer @
- 2014 -2019 Senior Process Engineer for Excimer Laser Annealing @
- 2011 -2014 Copper Wire Bonding project and process engineer @
Lee Siong Education
- Unimap
Bachelor degree of material engineering (Materials Sciences)
2007-2011
Lee Siong Summary
- Lee Siong, based in Singapore, is currently a Senior Process Wire Bonding Engineer at STMicroelectronics. Lee Siong brings experience from previous roles at AUO and ON Semiconductor. Lee Siong holds a 2007 - 2011 Bachelor degree of material engineering in Materials Sciences @ Unimap. Lee Siong has 1 mobile phone numbers on RocketReach.
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