Technical Leader, Quality and Reliability Engineer (Motherboard and Tester Assembly) @ Intel Corporation
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Lay Chew Location
Penang, Malaysia
Lay Chew Work
2015 -
now Technical Leader, Quality and Reliability Engineer (Motherboard and Tester Assembly) @
2014 -
2015 Senior Quality and Reliability engineer (Microprocessor) @
2013 -
2014 Product Development Engineer @
2008 -
2013 Failure Analysis Engineer @
Lay Chew Education
Multimedia University
Master of microelectronic engineering (Microelectronic engineering)
2013
-
2016
University Malaya
Bachelor of Applied Science (B.A.Sc.) (Industrial chemistry)
2005
-
2008
Lay Chew Skills
Risk Assessment
8D Problem Solving
JMP
Product Quality
Quality System
Failure Analysis
Design of Experiments
FMEA
Semiconductor Industry
Lay Chew Summary
Lay Chew, based in Penang, Malaysia, is currently a Technical Leader, Quality and Reliability Engineer (Motherboard and Tester Assembly) at Intel Corporation. Lay Chew brings experience from previous roles at Intel Corporation and Intel. Lay Chew holds a 2013 - 2016 Master of microelectronic engineering in Microelectronic engineering @ Multimedia University. With a robust skill set that includes Risk Assessment, 8D Problem Solving, JMP, Product Quality, Quality System and more. Lay Chew has 4 emails on RocketReach.
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