Lay Chew Email
Technical Leader, Quality and Reliability Engineer (Motherboard and Tester Assembly) @ Intel Corporation
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Lay Chew Location
- Penang, Malaysia
Lay Chew Work
- Technical Leader, Quality and Reliability Engineer (Motherboard and Tester Assembly) @ (October 2015 - Present)
- Senior Quality and Reliability engineer (Microprocessor) @ (August 2014 - October 2015)
- Product Development Engineer @ (June 2013 - August 2014)
- Failure Analysis Engineer @ (August 2008 - June 2013)
Lay Chew Education
- Multimedia University
Master of microelectronic engineering (Microelectronic engineering)
2013-2016 - University Malaya
Bachelor of Applied Science (B.A.Sc.) (Industrial chemistry)
2005-2008
Lay Chew Skills
- Risk Assessment
- 8D Problem Solving
- JMP
- Product Quality
- Quality System
- Failure Analysis
- Design of Experiments
- FMEA
- Semiconductor Industry
Lay Chew Summary
- Lay Chew, based in Penang, Malaysia, is currently a Technical Leader, Quality and Reliability Engineer (Motherboard and Tester Assembly) at Intel Corporation. Lay Chew brings experience from previous roles at Intel Corporation and Intel. Lay Chew holds a 2013 - 2016 Master of microelectronic engineering in Microelectronic engineering @ Multimedia University. With a robust skill set that includes Risk Assessment, 8D Problem Solving, JMP, Product Quality, Quality System and more. Lay Chew has 4 emails on RocketReach.
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