Kushal Doshi Email
Engineer (IC Packaging) @ Qualcomm
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Kushal Doshi Location
- Santa Clara, CA, US
Kushal Doshi Work
- 2023 -now Engineer (IC Packaging) @
- 2021 -2022 Undergraduate Teaching Assistant @
- 2022 -2022 Interim Engineering Intern @
- 2021 -2022 Undergraduate Research Assistant @
- 2021 -2021 Purdue Overclocking Group @
- 2020 -2020 Student Associate @ Windsor Dining Court, Purdue University
- 2018 -2018 Intern @ MagicRise
- 2017 -2017 Marketing Intern @ Bombaykala Books
Kushal Doshi Education
- Purdue University
Bachelor of Science - BS (Mechanical Engineering)
2019-2023 - Dhirubhai Ambani International School
High School Diploma (International Baccalaureate Diploma Program)
2014-2019
Kushal Doshi Summary
- Kushal Doshi, based in Santa Clara, CA, US, is currently a Engineer (IC Packaging) at Qualcomm. Kushal Doshi brings experience from previous roles at Purdue University Mechanical Engineering and Qualcomm. Kushal Doshi holds a 2019 - 2023 Bachelor of Science - BS in Mechanical Engineering @ Purdue University. Kushal Doshi has 2 emails on RocketReach.
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