Kun Pan's Location

Los Angeles, California, United States

Kun Pan's Work

Kun Pan's Education

  • National Taiwan University

    Masters

    2007 - 2009
  • National Cheng Kung University

    2003 - 2007
  • Wuling Senior High School

Kun Pan's Skills

  • CMOS
  • Semiconductor Device
  • Semiconductor Process
  • Semiconductor Fabrication
  • Compound Semiconductors
  • GaN
  • Semiconductors
  • Characterization
  • SPICE
  • GAAS

Kun Pan's Summary

Kun Pan, based in Los Angeles, California, United States, is currently a Device Integration Engineer at Global Communication Semiconductors,inc., bringing experience from previous roles at TSMC and National Taiwan University. Kun Pan holds a 2007 - 2009 Masters @ National Taiwan University. With a robust skill set that includes CMOS, Semiconductor Device, Semiconductor Process, Semiconductor Fabrication, Compound Semiconductors and more, Kun Pan contributes valuable insights to the industry. Kun Pan has 1 email on RocketReach.

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