Kun Pan's Location
Los Angeles, California, United States
Kun Pan's Work
Kun Pan's Education
National Taiwan University
Masters
2007 - 2009
National Cheng Kung University
2003 - 2007
Wuling Senior High School
Kun Pan's Skills
Kun Pan's Summary
Kun Pan, based in Los Angeles, California, United States, is currently a Device Integration Engineer at Global Communication Semiconductors,inc., bringing experience from previous roles at TSMC and National Taiwan University. Kun Pan holds a 2007 - 2009 Masters @ National Taiwan University. With a robust skill set that includes CMOS, Semiconductor Device, Semiconductor Process, Semiconductor Fabrication, Compound Semiconductors and more, Kun Pan contributes valuable insights to the industry. Kun Pan has 1 email on RocketReach.