Kun Fang's Location
California, United States
Kun Fang's Work
Kun Fang's Education
Kun Fang's Skills
Kun Fang's Summary
Kun Fang, based in California, United States, is currently a IC Packaging Engineer (Substrate Technology) at Qualcomm, bringing experience from previous roles at Qualcomm, Journal of Microelectronics and Electronic Packaging (IMAPS) and Laboratory for Electronics Assembly and Packaging, Auburn University. Kun Fang holds a 2010 - 2015 Doctor of Philosophy (Ph.D.) in Electronics Packaging and Assembly @ Auburn University. With a robust skill set that includes Thin Films, E-beam & Sputter Deposition, PECVD, Photolithography, Electroplating and more, Kun Fang contributes valuable insights to the industry. Kun Fang has 3 emails and 1 mobile phone number on RocketReach.